Process |
Metal |
Name |
type |
Usage & Feature |
Bump etch |
Ti |
Ti etchant |
L |
Fast etching, No under-cut problem, No solder attack |
Uni-Ti2 |
L |
No solder and Al damage, No residue, No undercut (H2O2 base) |
Ti7 |
L |
Weak alkali type, No undercut |
Ti-W |
Ti-W etchant |
L |
Ammonium base, No solder damage |
Uni-TiW |
L |
H2O2 base, No solder damage, No undercut |
Ti7 |
L |
H2O2 base, No undercut, No solder damage, strong |
Ni |
Ni etchant |
L |
Uniform etching |
Ni-V |
Ni-V etchant |
L |
Fast speed |
Ni-V |
Ni-V etchant 2 |
L |
No solder damage |
Cu |
Cu etchant 3 |
L |
No solder damage, H2O2 base |
Uni-Cu |
L |
No solder damage No undercut |
Cu |
Activator 1 |
L |
Pre-treatment acid cleaner for Bump |
Au |
Uni-Au |
L |
Fast and uniform etching |
Ni-V/Cu |
UC-7000 |
L |
NiV/Cu etchant, uniform and no under-cut |
|
|
UC-30 |
L |
Surfactant for acid etchant for Bump |
Stripper |
PR |
UniPR-100 |
L |
Negative & positive Photoresist stripper, No metal damage |
